German:
Der transparente Schrumpfschlauch von MDPC-X hat nicht nur den offensichtlichen Vorteil, dass nun auch Anfänger die Shrinkless Methode leichter üben und perfektionieren können, sondern bietet noch deutlich mehr:
Micro:
- 3:1 Schrumpf Verhältnis mit 4.50mm Durchmesser
- 8mm max. Außendurchmesser für einfaches "überstülpen" über den Sleeve und damit bis zu 5.5:1 Schrumpfverhältnis
- Schrumpft auf 1,5mm
- Perfekt geschmolzener Sleeve durch transparentes Material
- Weiches, 0,2mm dünnes Material mit dem Verzicht auf jeglichen Kleber
- Shrink Temperatur (min) 90 Grad
- Perfekt für normale Litzen mit MDPC-X Sleeve geeignet, sowie dem neuen Micro Sleeve und damit der Herstellung für gesleevte EPS, PCI-E, ATX, Sata und 4Pin Power Kabeln & den neuen PCI-E 5.0 Kabeln!
- Hergestellt in Deutschland und weltweit qualitativ einzigartig!
Verkauf in 30cm (1ft) Stücken.
Small:
- 4:1 Schrumpf Verhältnis.
- 7.4mm Außendurchmesser für einfaches "überstülpen" über den Sleeve
- Schrumpft auf 1,7mm für maximalen Halt und Kompression an unseren 1mm² und 1,5mm² PCHMG Litzen
- Perfekt geschmolzener Sleeve durch transparentes Material
- Weiches, 0,2mm dünnes Material mit dem Verzicht auf jeglichen Kleber
- Shrink Temperatur (min) 90 Grad
- Perfekt für normale Litzen mit MDPC-X Sleeve geeignet und damit der Herstellung für gesleevte EPS, PCI-E, ATX, Sata und 4Pin Power Kabeln
- Hergestellt in Deutschland und weltweit qualitativ einzigartig!
Medium:
- 3.4:1 Schrumpf Verhältnis.
- 13mm Außendurchmesser für einfaches "überstülpen" über den Sleeve
- Schrumpft auf 3,8mm für maximalen Halt und Kompression
- Perfekt geschmolzener Sleeve durch transparentes Material
- Weiches, dünnes Material mit dem Verzicht auf jeglichen Kleber
- Shrink Temperatur (min) 90 Grad
- Hergestellt in Deutschland und weltweit qualitativ einzigartig!
Big:
- 3:1 Schrumpf Verhältnis.
- 25mm Außendurchmesser für einfaches "überstülpen"
- Schrumpft auf 8mm für maximalen Halt und Kompression
- Perfekt geschmolzener Sleeve durch transparentes Material
- Weiches, dünnes Material mit dem Verzicht auf jeglichen Kleber
- Shrink Temperatur (min) 90 Grad
- Hergestellt in Deutschland und weltweit qualitativ einzigartig!
Verkauf in 20cm Stücken.
English:
This is - very likely - the best heat-shrink in existence for the purpose of cable sleeving.
Micro:
30 cm (1 ft) of MDPC Heatshrink 3:1 MICRO Clear. Before shrinking it has an initial diameter of 4.5 mm and goes down to 1.5 mm after shrinking.
This MICRO heatshrink is used for special applications where SMALL size would already be too big. It is especially useful for a controlled melting of the sleeving inside the heatshrink, because you have a clear view on what's happening.
Featuring extreme overexpansion capabilities allow for even bigger initial object diameters. With a long nosed plier inserted into the heatshrink to widen the inner diameter, you can easily and safely reach an ID of 8.0 mm - resulting in a shrink ratio of almost 5.5:1! Enjoy a class of its own when it comes to heatshrink.
This heat-shrink has a dielectric strength of 22 kV/mm and an initial shrink temperature (Min) of only 90°C. The constant operating range at temperatures from -60°C to +140°C allows it to be used safely in many environments. Its extremely good short term resistance to fire is especially important for the “shrinkless” melting technique.
Enjoy a class of its own when it comes to heat-shrink.
Small:
Initial 7.4mm ID (over-expanded > 10mm) for total clearance when moving it over the cable sleeving in every situation.
Perfect shaping of melted sleeving on the crimp terminal.
- See the cable sleeve through the heat-shrink for a 100% precise positioning of the sleeving.
- See the melting process of the cable sleeving through the heat-shrink while doing the “shrinkless method”.
- Extremely soft material for the most extreme grip on wires and cable sleeve without the use of glue.
- Ultra-thin material (0.2 mm at initial diameter) combined with extreme transparency, almost invisible on top of cable sleeving.
- Dielectric strength of 22 kV/mm. Shrink temperature (Min) of only 90°C. Constant operating range at temperatures from -60°C to +140°C. Extremely good short term resistance to fire, especially important for the “shrinkless” melting technique.
- Made in Germany only for MDPC-X. Globally unique product in a class of its own.
Medium:
- 4:1 shrink ratio.
- Initial 13.8 mm ID for total clearance when moving the heat-shrink over many connectors and the cable sleeving in every situation.
- Shrinking down to 3.5 mm for maximum grip and compression on the cable and sleeving.
- See the cable sleeve through the heat-shrink for a 100% precise positioning of the sleeving.
- See the melting process of the cable sleeving through the heat-shrink while doing the “shrinkless method”. With some practice, you can often melt together the connector plastic material with the cable sleeving.
- Extremely soft material for the most extreme grip on wires and cable sleeve without the use of glue.
- Ultra-thin material (0.25 mm at initial diameter) combined with extreme transparency, almost invisible on top of cable sleeving.
- Dielectric strength of 22 kV/mm. Shrink temperature (Min) of only 90°C. Constant operating range at temperatures from -60°C to +140°C. Extremely good short term resistance to fire, especially important for the “shrinkless” melting technique.
- Made in Germany only for MDPC-X. Globally unique product in a class of its own.
The inner diameter of our MEDIUM (formerly called "SATA") heatshrink is 13.0 mm before shrinking (it can be overexpanded to more by using a long nosed plier or similar to stretch the heatshrink tubing from the inside).After maximum shrinking, the inner diameter of MEDIUM heatshrink can shrink down to 3.8 mm. The maximum shrink ratio of this heatshrink is 3.4:1.
Big:
- Halogen-free.
- 3:1 shrink ratio.
- No glue, no dual wall.
- Initial 25 mm ID for total clearance when moving the heat-shrink over many connectors and the cable sleeving in every situation.
- Shrinking down to 8 mm for maximum grip and compression on the cable and sleeving.
- Extreme transparency and very high grip.
- Dielectric strength of 22 kV/mm. Shrink temperature (Min) of only 90°C. Constant operating range at temperatures from -60°C to +140°C. Extremely good short term resistance to fire.
